push-out shear bond strength of four types of glass ionomers when used to bond amalgam:

Home Forums Endodontics & conservative dentistry push-out shear bond strength of four types of glass ionomers when used to bond amalgam:

Welcome Dear Guest

To create a new topic please register on the forums. For help contact : discussdentistry@hotmail.com

Currently, there are 0 users and 1 guest visiting this topic.
Viewing 1 post (of 1 total)
  • Author
    Posts
  • #16064
    Drsumitra
    Offline
    Registered On: 06/10/2011
    Topics: 238
    Replies: 542
    Has thanked: 0 times
    Been thanked: 0 times

    Hybrid Ionomer Cements or Resin-modified Glass Ionomers or Dual-Cured GIC
    These combine an acid-base reaction of the traditional glass ionomer with a self-cure amine-peroxide polymerization reaction. These light-cured systems have been developed by adding polymerizable functional methacrylate groups with a photo-initiator to the formulation. Such materials undergo both an acid-base ionomer reaction as well as curing by photo-initiation and self cure of methacrylate carbon double bonds or in other words their acid-base reactions are supplemented by a second resin polymerization initiated (usually) by a light-curing process. For this reason they’re also called Dual-Cured GIC. Developed in 1992 the resin-modified glass ionomer cements in their simplest form are glass ionomer cements that contain a small quantity of a water-soluble, polymerizable resin component. More complex materials have been developed by modifying the polyalkenoic acid with side chains that could polymerize by light-curing mechanisms in the presence of photo initiators, but they remain glass ionomer cements by their ability to set by means of the acid-base reaction.
    Modern resin modified glass ionomer cements include Advance, GC Fuji PLUS [1] and Vitremer Luting. Most recent development in this field are the paste-paste resin modified GIC luting cement such as GC FujiCEM

     

Viewing 1 post (of 1 total)
  • You must be logged in to reply to this topic.